Global Flip Chip Market was valued US$ 22.91 Bn in 2018 and is expected to reach US$ 39.85Bn by 2026 at a CAGR of 7.16 % during the forecast period.
Global flip chip market is mainly driven by the developing internet of things: a network of physical devices, vehicles, buildings, and other items that include embedded electronics, software, sensors, actuators, and network connectivity along with its technological advantage over the traditional wire bond electrical connection makes it the excellent alternative. The flip-chip market is highly technology driven and companies are mainly focusing on discovering new technologies for the bumping process, which, in turn, is increasing the demand for raw materials required for manufacturing. However, some of the major restraints associated with the flip chip industry include the huge initial investment required for setting up new manufacturing facility and less available options for customization.
The report study has analyzed revenue impact of covid-19 pandemic on the sales revenue of market leaders, market followers and disrupters in the report and same is reflected in our analysis.
3D IC is expected to record the highest growth rate as it is equipped with all the additional advantages to that of 2.5D IC, such as enhanced capacity, improved performance, and compact system space requirements and low power consumption. The growing demand for reduced latency, increasing density, greater bandwidth, and lower power consumption are driving the adoptions of 3D-IC designs.
From industry segment, electronics held the largest market share with XX% and would also grow at the highest rate. Smartphones & tablets are observed to have the highest adoption among all the consumer electronic devices, because of their small form factor and better performance requirements to operate at a higher bandwidth, at a relatively lower cost. The automotive& transport segment is expected to grow at a second-highest CAGR rate, catapulting the flip chip technology market further.
Growing economies in Asia-Pacific region, such as India and China impact every industry, including semiconductors. The Asia-Pacific flip chip market is estimated to grow at a rapid pace, due to rising proliferation of consumer electronics in this region. With the improving economic conditions, increasing disposable income, increasing number of youth population, and rising employment rate, the consumer electronic market is flourishing in this region. China’s plans to focus on semiconductor sector as a part of economic year plan and strong growth of Taiwan’s semiconductor and electronics industry will augment the market for Flip chip in this region. With rising internet penetration and various government initiatives, such as smart cities, smart grids and smart transportation, the IoT market is set to explode in this region over the next decade. This will create necessary demand for the flip chip market.North America holds the second highest market share of the global flip chip technology market. Due to the presence of major players in the regions and high investments in the research and development activities are expected to drive the market.
The objective of the report is to present a comprehensive assessment of the market and contains thoughtful insights, facts, historical data, industry-validated market data and projections with a suitable set of assumptions and methodology. The report also helps in understanding dynamics, structure by analyzing the market segments by type, products, application, and region and, project the global market size. The report also provides a clear representation of competitive analysis of key players by product, price, financial position, product portfolio, growth strategies, and regional presence in the Flip Chip market. The report also provides PEST analysis, PORTER’s analysis, SWOT analysis to address the question of shareholders in arranging the efforts and investment in the near future to a particular market segment.
Scope of Global Flip Chip Market
Global Flip Chip Market, By Packaging Technology
• 3D IC
• 2.5D IC
• 2D IC
Global Flip Chip Market, By Bumping Technology
• Copper Pillar
• Solder Bumping
• Tin-lead eutectic solder
• Lead-free solder
• Gold Bumping
Global Flip Chip Market, By Industry
• Automotive & Transport
Global Flip Chip Market, By Region
• North America
• Asia Pacific
• Middle East & Africa
• South America
Key players operating in Global Flip Chip Market
• Amkor Technology Inc.
• IBM Corporation
• Intel Corporation
• Taiwan Semiconductor Manufacturing Company Limited
• Samsung Electronics Co. Ltd
• Texas Instruments Inc.
• GlobalFoundries U.S. Inc.
• Stats ChipPAC Ltd
• NepesPte Ltd
• Powertech Technology.
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